XinTec will employ the systems for its CSP production that is used for the manufacture of CMOS and CCD linear and area array image sensors, light detection devices and memories.
This follow-on order, which adds to XinTec’s previously installed SUSS automated production full-field exposure and coating systems shows the continued success of SUSS equipment in the fast expanding field of wafer level packaging. “During the past years lithography equipment from SUSS MicroTec has demonstrated outstanding performance in the areas of wafer level packaging”, says C.A Lin, VP Operation of Xintec. ”SUSS MicroTec’s mask aligners and coaters are known for their reliability, low cost of ownership, and great flexibility in processing various substrates and resists, which provides us with the technology needed to submit the latest design in chips size packages to the industry.”
SUSS Gamma systems are efficient cluster tracks capable of employing leading technology for wafer coat/bake and develop processes while maintaining all the process flexibility for which SUSS has been recognized. SUSS MA8 aligners are the leading system solution for lithography in R&D and Pre-Production on formats up to 200 mm.
“We are honored that one of the leading Taiwanese chip scale packaging service providers has decided to develop its innovative packaging solutions on SUSS equipment" comments Rolf Wolf, managing director for SUSS Micro Tec’s lithography division. "XinTec has selected SUSS equipment because it is capable to perfectly support the fully packaged integrated circuit by WLPCSP technology, one of the most efficient packaging process. In addition all processes, developed on the manual SUSS aligner are exactly transferable to one of our fully automated exposure systems. This capability is essential for finding commercial uses for our novel technologies."
About XinTec, Inc.:
XinTec is a pioneering company that provides advanced Wafer-Level Chip Size Packaging (CSP) technology, IC Packaging and a wide range of manufacturing services to the global semiconductor market. The company is headquartered in Chung-Li Industrial Park, Taiwan. XinTec Wafer Level CSP is a mainstream wafer level packaging technique, offering key advantages over conventional chip packages such as miniaturized and reliable design, increased functionality and board capacity, lower cost and enhanced quality for applications in cellular phones, PDAs, still cameras and other electronic devices. In response to strong market demand, XinTec is rapidly expanding its production capacity. For more information, please visit http://www.xintec.com.tw.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.
