CPS has been supplying AlSiC components for use in hermetic microelectronic packages since 1987 and has assembled hermetic packages containing AlSiC for certain select customers since that time. CPS is now pleased to offer highly engineered hermetic microelectronic packages made from materials such as Kovar, aluminum, and steel, in addition to AlSiC, to the market at large.
Grant Bennett, President, said “The strong engineering and manufacturing competencies CPS has developed in our AlSiC business are directly applicable to the broader hermetic microelectronic packaging business. We are delighted to respond to the requests of many customers to expand our product line to include hermetic packages made from more traditional materials in addition to hermetic packages made from AlSiC. This product line expansion is a very attractive business opportunity in and of itself, it will also allow us to accelerate the penetration of AlSiC into a broader number of hermetic packaging applications.”
CPS operates in a vertically integrated 38,000 square foot manufacturing facility in Chartley, MA. CPS has in-house tooling capability, state-of-the-art machining capability, strong engineering and design departments as well as material scientists on staff. CPS’ Chartley facility is certified to ISO:9001:2000 and CPS provides quality assurance testing to MID STD 883 and MIL STD 202 for hermetic packages.
CPS is the world-wide leader in developing, manufacturing and marketing advanced metal matrix composites for the electronics, robotics and other industries. CPS’ products are primarily used in high-density integrated circuit packaging, power semiconductor modules, hermetic microelectronic packages and robotic applications.
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