Rim Semiconductor Selects World’s Largest Independent Chip Fabricator to Make Product

Rim Semiconductor Company (OTCBB:RSMI), an innovator in video-over-copper technology, announced that Taiwan Semiconductor Manufacturing Company, Inc. (TSMC) will manufacture its new Cupria™ 5001 transport processor. Rim Semi’s Cupria™ 5001 will be produced at TSMC’s Hsinchu Science Park location in Taiwan. TSMC is the world’s largest semiconductor foundry operating ten fabrication plants globally, five at this location, and also has substantial external capacity commitments at its joint venture fab, SSMC.

Rim Semi has also selected a new development partner to assist with the transition of its technology to TSMC. This partner’s services would supplement the work of Rim Semi’s current development partner, HelloSoft of San Jose, California, and Hyderabad, India, and its own engineering staff at its design centers in Portland, Oregon and Kanata, Ontario, Canada.

“When a broadband chip becomes widely accepted, demand can easily outstrip the ability of a small foundry to supply product,” stated Brad Ketch, CEO of Rim Semiconductor Company. “By engaging with TSMC, we believe that we have set in place the ability to effectively support volume growth.”

The Cupria™ 5001 is the first product in a planned family of copper transport processors. It is based on Rim Semiconductor’s innovative new Internet Protocol Subscriber Line (IPSL) technology. Cupria™ delivers significantly more bandwidth over longer distances, increasing the total available market for triple play services while lowering network costs. The IP-based technology offers a better end-user experience than other video-over-copper technologies to deliver superior image quality.

TSMC’s corporate headquarters are in Hsinchu, Taiwan, and its website is www.tsmc.com.

About Rim Semiconductor

Rim Semiconductor Company (OTCBB:RSMI) develops technology for telecommunications companies to deliver demanding new video and data services with lower network costs. The company’s products allow data to be transmitted at greater speed and across extended distances over existing copper wire—all with the highest quality of service—for a better end-user experience. For more information, visit www.rimsemi.com.

With the exception of historical information contained in this press release, this press release may include "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. These statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements, including but not limited to the following: product development difficulties; market demand and acceptance of products; the impact of changing economic conditions; business conditions in the Internet and telecommunications industries; reliance on third parties, including potential suppliers, licensors, and licensees; the impact of competitors and their products; risks concerning future technology; and other factors detailed in this press release and in the company's Securities and Exchange Commission filings. Rim Semiconductor is under no obligation to revise or update any forward looking statement in order to reflect events or circumstances that may arise in the future.